参数资料
型号: SI4704-D50-GM
厂商: Silicon Laboratories Inc
文件页数: 31/34页
文件大小: 0K
描述: IC FM RADIO RECEIVER ADV 20-QFN
标准包装: 490
频率: 64MHz ~ 108MHz
调制或协议: FM
应用: 通用
数据接口: PCB,表面贴装
天线连接器: PCB,表面贴装
电源电压: 2.7 V ~ 5.5 V
工作温度: -20°C ~ 85°C
封装/外壳: 20-UFQFN 裸露焊盘
供应商设备封装: 20-QFN(3x3)
包装: 托盘
Si4704/05-D50
Table 14. PCB Land Pattern Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Max
Min
Max
D
2.71 REF
GE
2.10
D2
1.60
1.80
W
0.34
e
E
0.50 BSC
2.71 REF
X
Y
0.28
0.61 REF
E2
1.60
1.80
ZE
3.31
f
GD
2.53 BSC
2.10
ZD
3.31
Notes: General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at maximum material condition (MMC). Least material
condition (LMC) is calculated based on a fabrication allowance of 0.05 mm.
Notes: Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 μm minimum, all the way around the
pad.
Notes: Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This
provides approximately 70% solder paste coverage on the pad, which is optimum
to assure correct component stand-off.
Notes: Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for small body components.
Rev. 1.0
31
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