参数资料
型号: SI5933CDC-T1-E3
厂商: Vishay Siliconix
文件页数: 1/11页
文件大小: 0K
描述: MOSFET P-CH 20V 1206-8
标准包装: 3,000
系列: TrenchFET®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 144 毫欧 @ 2.5A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 6.8nC @ 5V
输入电容 (Ciss) @ Vds: 276pF @ 10V
功率 - 最大: 2.8W
安装类型: 表面贴装
封装/外壳: 8-SMD,扁平引线
供应商设备封装: 1206-8 ChipFET?
包装: 带卷 (TR)
Si5933CDC
Vishay Siliconix
Dual P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( Ω )
0.144 at V GS = - 4.5 V
I D (A) a
- 3.7
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFET
- 20
0.180 at V GS = - 2.5 V
0.222 at V GS = - 1.8 V
- 3.0
- 3.0
4.1 nC
? 100 % R g Tested
? Compliant to RoHS Directive 2002/95/EC
1206-8 ChipFET ?
1
APPLICATIONS
? Load Switch for Portable Devices
D 1
S 1
G 1
S 1
S 2
D 1
D 2
D 2
S 2
G 2
Marking Code
DI XXX
Lot Traceability
G 1
G 2
and Date Code
Part #
Bottom View
Code
D 1
D 2
Ordering Information: Si5933CDC-T1-E3 (Lead (Pb)-free)
Si5933CDC-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
- 20
±8
- 3.7
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
- 3.0
- 2.5 b, c
- 2.0 b, c
- 10
- 2.3
- 1.1 b, c
2.8
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
1.8
1.3 b, c
W
T A = 70 °C
0.8 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient b, f t ≤ 5s R thJA
Maximum Junction-to-Foot (Drain) Steady State R thJF
82 99
35 45
°C/W
Notes:
a. Based on T C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile ( www.vishay.com/ppg?73257 ). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 130 °C/W.
Document Number: 68822
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
1
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