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参数资料
型号： SI7228DN-T1-GE3
厂商： Vishay Siliconix
文件页数： 2/13页
文件大小： 0K
描述： MOSFET N-CH 30V PWRPAK 1212-8
标准包装： 3,000
系列： TrenchFET®
FET 型： 2 个 N 沟道（双）
FET 特点： 标准
漏极至源极电压(Vdss)： 30V
电流 - 连续漏极(Id) @ 25° C： 26A
开态Rds（最大）@ Id, Vgs @ 25° C： 20 毫欧 @ 8.8A，10V
Id 时的 Vgs(th)（最大）： 2.5V @ 250µA
闸电荷(Qg) @ Vgs： 13nC @ 10V
输入电容 (Ciss) @ Vds： 480pF @ 15V
功率 - 最大： 23W
安装类型： 表面贴装
封装/外壳： PowerPAK? 1212-8 双
供应商设备封装： PowerPAK? 1212-8 Dual
包装： 带卷 (TR)
Si7228DN
Vishay Siliconix
SPECIFICATIONS T J = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
V DS Temperature Coefficient
V GS(th) Temperature Coefficient
V DS
Δ V DS /T J
Δ V GS(th) /T J
V GS = 0 V, I D = 250 μA
I D = 250 μA
30
34
-5
V
mV/°C
Gate-Source Threshold Voltage
V GS(th)
V DS = V GS , I D = 250 μA
1
2.5
V
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
I GSS
I DSS
I D(on)
V DS = 0 V, V GS = ± 20 V
V DS = 30 V, V GS = 0 V
V DS = 30 V, V GS = 0 V, T J = 55 °C
V DS ≥ 5 V, V GS = 10 V
20
± 100
1
10
nA
μA
A
Drain-Source On-State Resistance a
Forward Transconductance a
R DS(on)
g fs
V GS = 10 V, I D = 8.8 A
V GS = 4.5 V, I D = 7.8 A
V DS = 15 V, I D = 8.8 A
0.0165
0.0205
20
0.020
0.025
Ω
S
Dynamic b
Input Capacitance
C iss
480
Output Capacitance
Reverse Transfer Capacitance
C oss
C rss
V DS = 15 V, V GS = 0 V, f = 1 MHz
115
46
pF
Total Gate Charge
Gate-Source Charge
Q g
Q gs
V DS = 15 V, V GS = 10 V, I D = 8.8 A
V DS = 15 V, V GS = 4.5 V, I D = 8.8 A
8.5
4.1
1.5
13
6.2
nC
Gate-Drain Charge
Q gd
1.3
Gate Resistance
R g
f = 1 MHz
0.6
3.2
6.4
Ω
Turn-On Delay Time
t d(on)
13
20
Rise Time
Turn-Off Delay Time
t r
t d(off)
V DD = 15 V, R L = 2.1 Ω
I D ? 7 A, V GEN = 4.5 V, R g = 1 Ω
12
12
20
20
Fall Time
Turn-On Delay Time
t f
t d(on)
10
5
15
10
ns
Rise Time
Turn-Off Delay Time
Fall Time
t r
t d(off)
t f
V DD = 15 V, R L = 2.1 Ω
I D ? 7 A, V GEN = 10 V, R g = 1 Ω
10
15
10
15
25
15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
I S
I SM
T C = 25 °C
19
35
A
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
V SD
t rr
Q rr
t a
t b
I S = 7 A, V GS = 0 V
I F = 7 A, dI/dt = 100 A/μs, T J = 25 °C
0.8
20
16
13
7
1.2
30
25
V
ns
nC
ns
Notes:
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 64806
S09-0666-Rev. A, 20-Apr-09
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