参数资料
型号: SI7431DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 200V 2.2A 8-SOIC
标准包装: 1
系列: TrenchFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 200V
电流 - 连续漏极(Id) @ 25° C: 2.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 174 毫欧 @ 3.8A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 135nC @ 10V
功率 - 最大: 1.9W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
其它名称: SI7431DP-T1-GE3DKR
Si7431DP
Vishay Siliconix
P-Channel 200 V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
- 200
R DS(on) ( ? )
0.174 at V GS = - 10 V
0.180 at V GS = - 6 V
I D (A)
- 3.8
- 3.6
Q g (Typ.)
88
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFETs
? Ultra-Low On-Resistance Critical for
Application
? Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
PowerPAK SO-8
? 100 % R g and Avalanche Tested
? Compliant to RoHS Directive 2002/95/EC
6.15 mm
1
S
2
S
S
5.15 mm
APPLICATIONS
? Active Clamp in Intermediate
S
3
4
G
DC/DC Power Supplies
8
D
7
D
D
G
6
5
D
Bottom View
Ordering Information: Si7431DP-T1-E3 (Lead (Pb)-free)
Si7431DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
D
P-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
- 200
± 20
Unit
V
Continuous Source Current (Diode Conduction)
Continuous Drain Current (T J = 150°C) a
Pulsed Drain Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
a
T A = 25 °C
T A = 70 °C
L = 0.1 mH
I D
I DM
I S
I AS
E AS
- 3.8
- 3.0
- 4.2
- 30
- 30
45
- 2.2
- 1.8
- 1.6
A
mJ
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b, c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
5.4
3.4
- 55 to 150
260
1.9
1.2
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
Steady State
R thJA
R thJC
18
50
1.0
23
65
1.5
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73116
S10-2246-Rev. E, 04-Oct-10
www.vishay.com
1
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