参数资料
型号: SI7456DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 100V 5.7A PPAK 8SOIC
产品目录绘图: DP-T1-(G)E3 Series 8-SOIC
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 5.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 25 毫欧 @ 9.3A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 44nC @ 10V
功率 - 最大: 1.9W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
产品目录页面: 1663 (CN2011-ZH PDF)
其它名称: SI7456DP-T1-GE3DKR
Si7456DP
Vishay Siliconix
N-Channel 100-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
100
R DS(on) ( Ω )
0.025 at V GS = 10 V
0.028 at V GS = 6.0 V
I D (A)
9.3
8.8
? Halogen-free According to IEC 61249-2-21
Available
? TrenchFET ? Power MOSFETs
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? PWM Optimized for Fast Switching
? 100 % R g Tested
PowerPAK SO-8
APPLICATIONS
? Primary Side Switch for High Density DC/DC
6.15 mm
1
S
2
S
S
5.15 mm
? Telecom/Server 48 V, Full-/Half-Bridge DC/DC
? Industrial and 42 V Automotive
8
D
7
D
D
3
4
G
D
6
D
5
Bottom View
G
Ordering Information: Si7456DP-T1-E3 (Lead (Pb)-free)
Si7456DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
100
± 20
Unit
V
Continuous Source Current (Diode Conduction)
Continuous Drain Current (T J = 150°C) a
Pulsed Drain Current
Avalanche Current
Single Avalanche Energy (Duty Cycle ≤ 1 %)
Maximum Power Dissipation a
a
T A = 25 °C
T A = 85 °C
L = 0.1 mH
T A = 25 °C
T A = 85 °C
I D
I DM
I AS
E AS
I S
P D
9.3
6.7
4.3
5.2
2.7
40
30
45
5.7
4.1
1.6
1.9
1.0
A
mJ
A
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b,c
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
Maximum Junction-to-Case
a
t ≤ 10 s
Steady State
Steady State
R thJA
R thJC
19
52
1.5
24
65
1.8
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71603
S09-0271-Rev. F, 16-Feb-09
www.vishay.com
1
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