参数资料
型号: SI7460DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 60V 11A PPAK 8SOIC
产品目录绘图: DP-T1-(G)E3 Series 8-SOIC
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 9.6 毫欧 @ 18A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 100nC @ 10V
功率 - 最大: 1.9W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
产品目录页面: 1663 (CN2011-ZH PDF)
其它名称: SI7460DP-T1-GE3DKR
Si7460DP
Vishay Siliconix
N-Channel 60-V (D-S) Fast Switching MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
60
R DS(on) ( Ω )
0.0096 at V GS = 10 V
0.012 at V GS = 4.5 V
I D (A)
18
16
? Halogen-free According to IEC 61249-2-21
Available
? TrenchFET ? Power MOSFETs
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
PowerPAK SO-8
6.15 mm
1
S
S
5.15 mm
2
3
S
G
D
4
D
8
7
D
D
6
5
D
G
Bottom V ie w
Ordering Information: Si7460DP-T1-E3 (Lead (Pb)-free)
Si7460DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
60
± 20
Unit
V
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current
Continuous Source Current (Diode Conduction) a
Avalanche Current
Avalanche Energy
T A = 25 °C
T A = 70 °C
I D
I DM
I S
I AS
E AS
18
14
4.3
40
50
125
11
8
1.6
A
mJ
Maximum Power Dissipation
a
T A = 25 °C
T A = 70 °C
P D
5.4
3.4
1.9
1.2
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b,c
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
a
t ≤ 10 s
Steady State
R thJA
18
52
23
65
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R thJC
1.0
1.3
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72126
S09-0227-Rev. D, 09-Feb-09
www.vishay.com
1
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