参数资料
型号: SIC769CD-T1-E3
厂商: Vishay Siliconix
文件页数: 6/18页
文件大小: 0K
描述: IC CTLR PFC STAGE PPAK MLP66-40
标准包装: 3,000
系列: DrMOS
类型: 高端/低端驱动器
输入类型: PWM
输出数: 1
电流 - 输出 / 通道: 35A
电源电压: 3 V ~ 16 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: PowerPAK? MLP66-40
供应商设备封装: PowerPAK? MLP66-40
包装: 带卷 (TR)
其它名称: SIC769CD-T1-E3-ND
SIC769CD-T1-E3TR
SiC769
Vishay Siliconix
DETAILED OPERATIONAL DESCRIPTION
PWM Input with Tristate Function
The PWM input receives the PWM control signal from the V R
controller IC. The PWM input is designed to be compatible
with standard controllers using two state logic (H and L) and
advanced controllers that incorporate Tristate logic (H, L and
Tristate) on the PWM output. For two state logic, the PWM
input operates as follows. When PWM is driven above
V th_pwm_r the low side is turned off and the high side is turned
on. When PWM input is driven below V th_pwm_f the high side
turns off and the Low side turns on. For Tristate logic, the
PWM input operates as above for driving the MOSFETs.
However, there is an third state that is entered into as the
PWM output of Tristate compatible controller enters its high
impedance state during shut-down. The high impedance
state of the controller's PWM output allows the SiC769CD to
pull the PWM input into the Tristate region (see the Tristate
Voltage Threshold Diagram below). If the PWM input stays in
this region for the Tristate Hold-Off Period, t TSHO , both high
side and low side MOSFETs are turned off. This function
allows the V R phase to be disabled without negative output
voltage swing caused by inductor ringing and saves a
Schottky diode clamp. The PWM and Tristate regions are
separated by hysteresis to prevent false triggering. The
SiC769CD incorporates PWM voltage thresholds that are
compatible with 5 V logic.
Disable (DSBL#)
In the low state, the DSBL# pin shuts down the driver IC and
disables both high-side and low-side MOSFET. In this state,
the standby current is minimized. If DSBL# is left
unconnected an internal pull-down resistor will pull the pin
down to C GND and shut down the IC.
Diode Emulation Mode (SMOD) Skip Mode
When SMOD pin is low the diode emulation mode is enabled.
This is a non-synchronous conversion mode that improves
light load efficiency by reducing switching losses. Conducted
losses that occur in synchronous buck regulators when
inductor current is negative are also reduced. Circuitry in the
gate drive IC detects the inductor valley current when
inductor current crosses zero and automatically stops
switching the low side MOSFET. See SMOD Operation
Diagram for additional details. This function can be also be
used for a pre-biased output voltage. If SMOD is left
unconnected, an internal pull up resistor will pull the pin up to
V CIN (Logic High) to disable the SMOD function.
Thermal Shutdown Warning (THDN)
The THDN pin is an open drain signal that flags the presence
of excessive junction temperature. Connect a maximum of
20 k ? to pull this pin up to V CIN . An internal temperature
sensor detects the junction temperature. The temperature
threshold is 150 °C. When this junction temperature is
exceeded the THDN flag is set. When the junction
temperature drops below 135 °C the device will clear the
THDN signal. The SiC769CD does not stop operation when
the flag is set. The decision to shutdown must be made by an
external thermal control function.
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6
Voltage Input (V IN )
This is the power input to the drain of the high-side Power
MOSFET. This pin is connected to the high power
intermediate BUS rail.
Switch Node (V SWH and PHASE)
The Switch node V SWH is the circuit PWM regulated output.
This is the output applied to the filter circuit to deliver the
regulated high output for the buck converter. The PHASE pin
is internally connected to the switch node V SWH . This pin is
to be used exclusively as the return pin for the BOOT
capacitor. A 20.2 k ? resistor is connected between GH and
PHASE to provide a discharge path for the HS MOSFET in
the event that V CIN goes to zero while V IN is still applied.
Ground connections (C GND and P GND )
P GND (power ground) should be externally connected to
C GND (control signal ground). The layout of the Printed
Circuit Board should be such that the inductance separating
the C GND and P GND should be a minimum. Transient
differences due to inductance effects between these two pins
should not exceed 0.5 V.
Control and Drive Supply Voltage Input (V DRV ,V CIN )
V CIN is the bias supply for the gate drive control IC. V DRV is
the bias supply for the gate drivers. It is recommended to
separate these pins through a resistor. This creates a low
pass filtering effect to avoid coupling of high frequency gate
drive noise into the IC.
Bootstrap Circuit (BOOT)
The internal bootstrap switch and an external bootstrap
capacitor form a charge pump that supplies voltage to the
BOOT pin. An integrated bootstrap diode is incorporated so
that only an external capacitor is necessary to complete the
bootstrap circuit. Connect a boot strap capacitor with one leg
tied to BOOT pin and the other tied to PHASE pin.
Shoot-Through Protection and Adaptive Dead Time
(AST)
The SiC769CD has an internal adaptive logic to avoid shoot
through and optimize dead time. The shoot through
protection ensures that both high-side and low-side
MOSFET are not turned on the same time. The adaptive
dead time control operates as follows. When PWM input
goes high the LS gate starts to go low after a few ns. When
this signal crosses through 1.7 V the logic to switch the HS
gate on is activated. When PWM goes low the HS gate goes
low. When the HS gate-to-source drive signal crosses
through 1.7 V the logic to turn on the LS gate is activated.
This feature helps to adjust dead time as gate transitions
change with respect to output current and temperature.
Under Voltage Lockout (UVLO)
During the start up cycle, the UVLO disables the gate drive
holding high-side and low-side MOSFET gate low until the
input voltage rail has reached a point at which the logic
circuitry can be safely activated. The SiC769CD also
incorporates logic to clamp the gate drive signals to zero
when the UVLO falling edge triggers the shutdown of the
device. As an added precaution, a 20.2 k ? resistor is
connected between GH and PHASE to provide a discharge
path for the HS MOSFET.
Document Number: 64981
S11-0975-Rev. F, 16-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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