参数资料
型号: SPC5632MF0MLQA6
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: FLASH, 60 MHz, MICROCONTROLLER, PQFP144
封装: 20 X 20 MM, 0.50 MM PITCH, 1.40 HEIGHT, ROHS COMPLIANT, LQFP-144
文件页数: 80/122页
文件大小: 1173K
代理商: SPC5632MF0MLQA6
MPC5634M Microcontroller Data Sheet, Rev. 6
Electrical characteristics
Freescale Semiconductor
60
3.3
Thermal characteristics
3 The V
FLASH supply is connected to VRC33 in the package substrate. This specification applies to calibration package
devices only.
4 Allowed 5.3 V for 10 hours cumulative time, remaining time at 3.3 V +10%.
5 Allowed 6.8 V for 10 hours cumulative time, remaining time at 5 V +10%.
6 The pin named as V
RC33 is internally connected to the pads VFLASH and VRC33 in the 144 LQFP package. These
limits apply when the internal regulator is disabled and VRC33 power is supplied externally.
7 All functional non-supply I/O pins are clamped to V
SS and VDDE, or VDDEH.
8 AC signal overshoot and undershoot of up to 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
9 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.
10 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH supplies, if
the maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage
specifications.
11 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage
specifications.
12 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
13 Total injection current for all analog input pins must not exceed 15 mA.
14 Lifetime operation at these specification limits is not guaranteed.
15 Solder profile per CDF-AEC-Q100.
16 Moisture sensitivity per JEDEC test method A112.
Table 9. Thermal characteristics for 144-pin LQFP
Symbol
C
Parameter
Conditions
Value
Unit
RθJA
CC
D Junction-to-Ambient, Natural Convection1
1 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board – 1s
43
°C/W
RθJA
CC
D Junction-to-Ambient, Natural Convection2
Four layer board – 2s2p
35
°C/W
RθJMA
CC
D Junction-to-Ambient (@200 ft/min)2
Single layer board –1s
34
°C/W
RθJMA
CC
D Junction-to-Ambient (@200 ft/min)2
Four layer board – 2s2p
29
°C/W
RθJB
CC
D Junction-to-Board2
2 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
22
°C/W
RθJCtop
CC
D Junction-to-Case (Top)3
3 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
8
°C/W
Ψ
JT
CC
D Junction-to-Package Top, Natural
Convection4
4 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
2
°C/W
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