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参数资料
| 型号： | SST12LF01-QDF |
| 厂商： | Microchip Technology |
| 文件页数： | 1/21页 |
| 文件大小： | 0K |
| 描述： | IC FRONT-END MODULE 24WQFN |
| 标准包装： | 3,000 |
| RF 型： | Bluetooth，WLAN |
| 频率： | 2.4GHz |
| 封装/外壳： | 12-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-WQFN（4x4） |
| 包装： | 带卷 (TR) |
2.4 GHz Front-End Module
A Microchip Technology Company
SST12LF01
Data Sheet
The SST12LF01 is a 2.4 GHz Front-End Module (FEM) that combines a high-per-
formance Low-Noise Amplifier (LNA) and a Power Amplifier (PA). Designed in
compliance with IEEE 802.11 b/g/n applications and based on GaAs PHEMT/HBT
technology, the SST12LF01 operates within the frequency range of 2.4- 2.55 GHz
at a very low DC-current consumption. The Transmitter chain has excellent linear-
ity, typically <3% added EVM up to 19 dBm output power, which is essential for 54
Mbps 802.11g operation while meeting 802.11g spectrum mask at 23 dBm. The
SST12LF01 is offered in a 24-contact WQFN package.
Features
? Gain:
– Typically 12 dB gain across 2.4–2.5 GHz for Receiver
(RX) chain.
– Typically 29 dB gain across 2.4–2.5 GHz over temperature
0°C to +80°C for Transmitter (TX) chain.
? Low-Noise Figure
– Typical 1.45 dB across 2.4–2.55 GHz
? 50 ? Input/Output matched along RX chain.
? Rx IIP3
– >1 dbm across 2.4–2.55 GHz
? High linear output power:
– >26.5 dBm P1dB
– Meets 802.11g OFDM ACPR requirement up to 23 dBm
– ~3% added EVM up to 19 dBm for
54 Mbps 802.11g signal
– Meets 802.11b ACPR requirement up to 24 dBm
? High power-added efficiency/Low operating cur-
rent for both 802.11g/b applications
– ~22%/210 mA @ P OUT = 22 dBm for 802.11g
– ~26%/240 mA @ P OUT = 23.5 dBm for 802.11b
? Low idle current
– ~70 mA I CQ
? Low shut-down current (Typical 2.5 μA)
? Built-in, Ultra-low I REF power-up/down control
– I REF <4 mA
? High-speed power-up/down
– Turn on/off time (10%- 90%) <100 ns
– Typical power-up/down delay with driver delay included
<200 ns
? High temperature stability
– ~1 dB gain/power variation between 0°C to +85°C
? Simple input/output matching
? Single positive power supply
? Packages available
– 24-contact WQFN – 4mm x 4mm
? All devices are RoHS compliant
Applications
? WLAN
? Bluetooth
? Wireless Network
?2011 Silicon Storage Technology, Inc.
www.microchip.com
DS75040A
12/11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SST12LF02 | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.4 GHz High-Gain, High-Efficiency Front-end Module Cordless phones |
| SST12LF02-QXCE | 功能描述:功率放大器 WLAN 11b/g/n FEM PA+SP3T RoHS:否 制造商:TriQuint Semiconductor 封装 / 箱体: 工作电源电压:28 V 电源电流:2.5 A 工作温度范围: 封装: |
| SST12LF03 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:2.4 GHz 高增益及高效率前端模块 |
| SST12LF03-Q3DE | 功能描述:射频前端 WLAN 11B/G/N FEM PA+LNA+SPDT RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
| SST12LF05-Q4CE | 功能描述:功率放大器 WLAN 11b/g/n FEM PA+SP2T+Filter+Balun RoHS:否 制造商:TriQuint Semiconductor 封装 / 箱体: 工作电源电压:28 V 电源电流:2.5 A 工作温度范围: 封装: |
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