参数资料
型号: SST89V516RD-33-C-PI
厂商: SILICON STORAGE TECHNOLOGY INC
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 33 MHz, MICROCONTROLLER, PDIP40
封装: PLASTIC, MS-011AC, DIP-40
文件页数: 60/80页
文件大小: 934K
代理商: SST89V516RD-33-C-PI
Data Sheet
FlashFlex51 MCU
SST89E516RD2 / SST89E516RD
SST89V516RD2 / SST89V516RD
63
2005 Silicon Storage Technology, Inc.
S71273-01-000
3/05
14.0 ELECTRICAL SPECIFICATION
Note: This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20ns) on Any Other Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260
°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240
°C for 10 seconds; please consult the factory for the latest information.
Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
TABLE
14-1: OPERATING RANGE
Symbol
Description
Min.
Max
Unit
TA
Ambient Temperature Under Bias
Standard
0
+70
°C
Industrial
-40
+85
°C
VDD
Supply Voltage
SST89E516RDx
4.5
5.5
V
SST89V516RDx
2.7
3.6
V
fOSC
Oscillator Frequency
SST89E516RDx
0
40
MHz
SST89V516RDx
0
33
MHz
Oscillator Frequency for IAP
SST89E516RDx
.25
40
MHz
SST89V516RDx
.25
33
MHz
T14-1.0 1273
TABLE
14-2: RELIABILITY CHARACTERISTICS
Symbol
Parameter
Minimum Specification
Units
Test Method
NEND1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Endurance
10,000
Cycles
JEDEC Standard A117
TDR1
Data Retention
100
Years
JEDEC Standard A103
ILTH1
Latch Up
100 + IDD
mA
JEDEC Standard 78
T14-2.0 1273
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SST89V516RD-33-I-PIE 8-BIT, FLASH, 33 MHz, MICROCONTROLLER, PDIP40
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