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参数资料
| 型号： | STM32F103VBT6TR |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 1.25 MHz, RISC MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 |
| 文件页数： | 51/92页 |
| 文件大小： | 1212K |
| 代理商： | STM32F103VBT6TR |
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STM32F103x8, STM32F103xB
Electrical characteristics
Doc ID 13587 Rev 11
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
●
Corrupted program counter
●
Unexpected reset
●
Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.
Table 30.
EMS characteristics
Symbol
Parameter
Conditions
Level/
Class
VFESD
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
VDD 3.3 V, TA +25 °C,
fHCLK 72 MHz
conforms to IEC 61000-4-2
2B
VEFTB
Fast transient voltage burst limits to be
applied through 100 pF on VDD and VSS
pins to induce a functional disturbance
VDD3.3 V, TA +25 °C,
fHCLK 72 MHz
conforms to IEC 61000-4-4
4A
Table 31.
EMI characteristics
Symbol
Parameter
Conditions
Monitored
frequency band
Max vs. [fHSE/fHCLK]
Unit
8/48 MHz 8/72 MHz
SEMI
Peak level
VDD 3.3 V, TA 25 °C,
LQFP100 package
compliant with
IEC 61967-2
0.1 to 30 MHz
12
dBV
30 to 130 MHz
22
19
130 MHz to 1GHz
23
29
SAE EMI Level
4
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相关代理商/技术参数 |
参数描述 |
|---|---|
| STM32F103VBT6XXX | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces |
| STM32F103VBT7 | 功能描述:ARM微控制器 - MCU 32BIT Cortex M3 M/D Performance LINE RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
| STM32F103VBT7TR | 功能描述:ARM微控制器 - MCU 32-Bit ARM Cortex MED Density 128kb PL RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
| STM32F103VBT7XXX | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces |
| STM32F103VBU6TR | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces |
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