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参数资料
| 型号： | STR635FZ1T6 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, TQFP-144 |
| 文件页数： | 42/51页 |
| 文件大小： | 1485K |
| 代理商： | STR635FZ1T6 |
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STR73xF
Package characteristics
47/51
4.2
Thermal characteristics
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
–TA is the Ambient Temperature in °C,
–
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
–PD is the sum of PINT and PI/O (PD = PINT + PI/O),
–PINT is the product of IDD and VDD, expressed in Watt. This is the Chip Internal
Power,
–PI/O represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2
(3)
Where:
–
K is a constant for the particular part, which may be determined from equation (3)
by measuring PD (at equilibrium) for a known TA. Using this value of K, the values
of PD and TJ may be obtained by solving equations (1) and (2) iteratively for any
value of TA
Table 26.
Thermal Characteristics
Symbol
Description
Package
Value (typical)
Unit
ΘJA
Thermal Resistance Junction-Ambient
LFBGA144
50
°C/W
TQFP144
40
TQFP100
40
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