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| 型号： | TDA8754HL/21/C1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | ADC |
| 英文描述： | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| 封装： | 20 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, SOT486-1, LQFP-144 |
| 文件页数： | 49/57页 |
| 文件大小： | 259K |
| 代理商： | TDA8754HL/21/C1 |
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TDA8754_7
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 3 May 2007
53 of 57
NXP Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msample/s
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 77 and 78
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 13.
Table 77.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 78.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
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| TDA8754HL27BE-S | 功能描述:视频模拟/数字化转换器集成电路 3X8 BIT VIDEO A/D-270 MSPS RoHS:否 制造商:Texas Instruments 输入信号类型:Differential 转换器数量:1 ADC 输入端数量:4 转换速率:3 Gbps 分辨率:8 bit 结构: 输入电压:3.3 V 接口类型:SPI 信噪比: 电压参考: 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TCSP-48 封装:Reel |
| TDA8755 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface |
| TDA8755T | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface |
| TDA8755TD-T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TV/Video Signal Processor |
| TDA8757 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Triple 8-bit ADC 170 Msps |
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