参数资料
型号: TE28F008B3B150
厂商: INTEL CORP
元件分类: DRAM
英文描述: SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
中文描述: 1M X 8 FLASH 3V PROM, 150 ns, PDSO40
封装: 10 X 20 MM, TSOP-40
文件页数: 8/49页
文件大小: 408K
代理商: TE28F008B3B150
SMART 3 ADVANCED BOOT BLOCK
–BYTE-WIDE
E
8
PRELIMINARY
A
14
A
12
A
8
V
PP
WP#
NC
A
7
A
4
A
15
A
10
WE#
RP#
A
19
A
18
A
5
A
2
A
16
A
13
A
9
A
6
A
3
A
1
A
17
NC
D
5
NC
D
2
NC
CE#
A
0
V
CCQ
A
11
D
6
NC
D
3
NC
D
0
GND
GND
D
7
NC
D
4
V
CC
NC
D
1
OE#
A
B
C
D
E
F
1
2
3
4
5
6
7
8
0605-03
NOTE:
Dotted connections indicate placeholders where there is no solder ball. These connections are reserved for future upgrades.
Routing is not recommended in this area.
Figure 2. 8-Mbit 48-Ball
μ
BGA* Chip Size Package
相关PDF资料
PDF描述
TE28F008B3T120 SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
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TE28F016B3T150 SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
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