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| 型号： | THS3111CDGNG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MSOP-8 |
| 文件页数： | 16/36页 |
| 文件大小： | 995K |
| 代理商： | THS3111CDGNG4 |
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T =125 C
J
°
T
Free-AirTemperature
C
A -
- °
P
=
DMax
T
-
Max
A
q
JA
www.ti.com........................................................................................................................................ SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009
entire circumference of the plated-through hole.
Maximum power dissipation levels are depicted in
Figure 65 for the available packages. The data for the
6. The top-side solder mask should leave the
PowerPAD packages assume a board layout that
terminals of the package and the thermal pad
follows the PowerPAD layout guidelines referenced
area with its five holes exposed. The bottom-side
above and detailed in the PowerPAD application note
solder mask should cover the five holes of the
(literature
number
also
thermal pad area. This prevents solder from
illustrates the effect of not soldering the PowerPAD to
being pulled away from the thermal pad area
a
PCB.
The
thermal
impedance
increases
during the reflow process.
substantially which may cause serious heat and
7. Apply solder paste to the exposed thermal pad
performance issues. Be sure to always solder the
area and all of the IC terminals.
PowerPAD to the PCB for optimum performance.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This results in a part
that is properly installed.
POWER DISSIPATION AND THERMAL
CONSIDERATIONS
The THS3110 and THS3111 incorporate automatic
thermal shutoff protection. This protection circuitry
shuts down the amplifier if the junction temperature
exceeds approximately +160°C. When the junction
temperature reduces to approximately +140°C, the
amplifier
turns
on
again.
But,
for
maximum
performance and reliability, the designer must take
care to ensure that the design does not exceed a
junction temperature of +125°C. Between +125°C
Results are with no airflow and PCB size = 3 in × 3 in (7,62 mm ×
7,62 mm);
θJA = 58.4°C/W for MSOP-8 with PowerPAD (DGN); θJA
and +150°C, damage does not occur, but the
= 95°C/W for SOIC-8 High-K Test PCB (D);
θJA = 158°C/W for
performance of the amplifier begins to degrade and
MSOP-8 with PowerPAD, without solder.
long
term
reliability
suffers.
The
thermal
characteristics of the device are dictated by the
Figure 65. Maximum Power Distribution
package
and
the
PC
board.
Maximum
power
vs Ambient Temperature
dissipation for a given package can be calculated
using the following formula.
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to not only consider quiescent power
(1)
dissipation, but also dynamic power dissipation. Often
Where:
times, this is difficult to quantify because the signal
PDMax is the maximum power dissipation in the
pattern is inconsistent, but an estimate of the RMS
amplifier (W)
power dissipation can provide visibility into a possible
TMax is the absolute maximum junction
problem.
temperature (°C)
TA is the ambient temperature (°C)
DESIGN TOOLS
θJA = θJC + θCA
Evaluation Fixtures, Spice Models, and
θJC is the thermal coefficient from the silicon
Application Support
junctions to the case (°C/W)
θCA is the thermal coefficient from the case to
Texas Instruments is committed to providing its
ambient air (°C/W)
customers with the highest quality of applications
support. To support this goal an evaluation board has
For systems where heat dissipation is more critical,
been developed for the THS3110 and THS3111
the THS3110 and THS3111 are offered in an
operational amplifiers. The board is easy to use,
MSOP-8 with PowerPAD package offering even
allowing for straightforward evaluation of the device.
better thermal performance. The thermal coefficient
The evaluation board can be ordered through the
for
the
PowerPAD
packages
are
substantially
Texas Instruments web site, www.ti.com, or through
improved over the traditional SOIC.
your local Texas Instruments sales representative.
Copyright 2003–2009, Texas Instruments Incorporated
23
相关PDF资料 |
PDF描述 |
|---|---|
| THS3110CDGN | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3110CDGNR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3111CDGNR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3111CDR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3111CD | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3111CDGNR | 功能描述:高速运算放大器 Single Lo-Noise Hi-Vltg Crnt-Feedbck RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3111CDGNRG4 | 功能描述:高速运算放大器 Single Lo-Noise Hi-Vltg Crnt-Feedbck RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3111CDR | 功能描述:高速运算放大器 Single Lo-Noise Hi-Vltg Crnt-Feedbck RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3111CDRG4 | 功能描述:高速运算放大器 Single Lo-Noise Hi-Vltg Crnt-Feedbck RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3111EVM | 功能描述:放大器 IC 开发工具 THS3111 Eval Mod RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
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