参数资料
| 型号： | TPS54260DRCR |
| 厂商： | Texas Instruments |
| 文件页数： | 38/52页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK ADJ 2.5A 10SON |
| 标准包装： | 3,000 |
| 系列： | SWIFT™, Eco-Mode™ |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 58 V |
| 输入电压： | 3.5 V ~ 60 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 100kHz ~ 2.5MHz |
| 电流 - 输出： | 2.5A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 10-SON 裸露焊盘（3x3） |
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SLVSA86A – MARCH 2010 – REVISED DECEMBER 2010
www.ti.com
Layout
Layout is a critical portion of good power supply design. There are several signals paths that conduct fast
changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise
or degrade the power supplies performance. To help eliminate these problems, the VIN pin should be bypassed
to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric. Care should be taken to
minimize the loop area formed by the bypass capacitor connections, the VIN pin, and the anode of the catch
diode. See Figure 62 for a PCB layout example. The GND pin should be tied directly to the power pad under the
IC and the power pad.
The power pad should be connected to any internal PCB ground planes using multiple vias directly under the IC.
The PH pin should be routed to the cathode of the catch diode and to the output inductor. Since the PH
connection is the switching node, the catch diode and output inductor should be located close to the PH pins,
and the area of the PCB conductor minimized to prevent excessive capacitive coupling. For operation at full rated
load, the top side ground area must provide adequate heat dissipating area. The RT/CLK pin is sensitive to noise
so the RT resistor should be located as close as possible to the IC and routed with minimal lengths of trace. The
additional external components can be placed approximately as shown. It may be possible to obtain acceptable
performance with alternate PCB layouts, however this layout has been shown to produce good results and is
meant as a guideline.
Vout
Output
Topside
Capacitor
Output
Inductor
Ground
Area
Route Boot Capacitor
Trace on another layer to
provide wide path for
Catch
Diode
topside ground
Input
Bypass
Vin
Capacitor
BOOT
VIN
EN
PH
GND
COMP
UVLO
Adjust
Resistors
Slow Start
Capacitor
SS/TR
RT/CLK
Frequency
Set Resistor
VSENSE
PWRGD
Thermal VIA
Compensation
Network
Resistor
Divider
Signal VIA
Figure 62. PCB Layout Example
Estimated Circuit Area
The estimated printed circuit board area for the components used in the design of Figure 49 is 0.55 in 2 . This area
does not include test points or connectors.
38
Product Folder Link(s): TPS54260
Copyright ? 2010, Texas Instruments Incorporated
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| TPS54260DRCT | 功能描述:直流/直流开关转换器 3.5V-60Vin,2.5A,2.5 MHz Step Down SWIFT RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| TPS54260EVM-597 | 功能描述:电源管理IC开发工具 2.5A,10.8-13.2Vin SWIFT Conv Eval Mod RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| TPS54260MDGQTEP | 功能描述:IC REG BUCK ADJ 2.5A 10MOSP 制造商:texas instruments 系列:Eco-Mode? 包装:剪切带（CT） 零件状态:在售 功能:降压 输出配置:正 拓扑:降压 输出类型:可调式 输出数:1 电压 - 输入（最小值）:3.5V 电压 - 输入（最大值）:60V 电压 - 输出（最小值/固定）:0.8V 电压 - 输出（最大值）:60V 电流 - 输出:2.5A 频率 - 开关:100kHz ~ 2.5MHz 同步整流器:无 工作温度:-40°C ~ 150°C（TJ） 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商器件封装:10-MSOP-PowerPad 标准包装:1 |
| TPS54260MDRCTEP | 功能描述:IC REG BUCK ADJ 2.5A 10VSON 制造商:texas instruments 系列:Eco-Mode? 包装:剪切带（CT） 零件状态:在售 功能:降压 输出配置:正 拓扑:降压 输出类型:可调式 输出数:1 电压 - 输入（最小值）:3.5V 电压 - 输入（最大值）:60V 电压 - 输出（最小值/固定）:0.8V 电压 - 输出（最大值）:60V 电流 - 输出:2.5A 频率 - 开关:100kHz ~ 2.5MHz 同步整流器:无 工作温度:-40°C ~ 150°C（TJ） 安装类型:表面贴装 封装/外壳:10-VFDFN 裸露焊盘 供应商器件封装:10-VSON（3x3） 标准包装:1 |
| TPS54260-Q1 | 制造商:TI 制造商全称:Texas Instruments 功能描述:3.5 V to 60 V STEP DOWN CONVERTER WITH ECO-MODEa?￠ |
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