参数资料
型号: TPS54326RGTT
厂商: Texas Instruments
文件页数: 14/29页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 3A 16QFN
标准包装: 250
系列: SWIFT™, D-CAP2™
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.76 V ~ 5.5 V
输入电压: 2 V ~ 18 V
PWM 型: 混合物
频率 - 开关: 700kHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-VFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-QFN-EP(3x3)
SLVSA13E – OCTOBER 2009 – REVISED JUNE 2012
Input Capacitor Selection
The TPS54326 requires an input decoupling capacitor and a bulk capacitor is needed depending on the
application. A ceramic capacitor over 10 μ F is recommended for the decoupling capacitor. An additional 0.1 μF
capacitor from pin 14 to ground is recommended. The capacitor voltage rating needs to be greater than the
maximum input voltage.
Bootstrap Capacitor Selection
A 0.1 μF ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is
recommended to use a ceramic capacitor.
VREG5 Capacitor Selection
A 1.0 μF ceramic capacitor must be connected between the VREG5 to GND pin for proper operation. It is
recommended to use a ceramic capacitor.
THERMAL INFORMATION
The PWP 14 pin package incorporates an exposed PowerPAD? and the QFN 16 pin package incorporates a
similar exposed thermal pad. These exposed thermal pads are designed to be connected to an external heatsink.
The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a
heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate
copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special
heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).
For additional information on the PowerPAD? package and how to use the advantage of its heat dissipating
abilities, see the Technical Brief, PowerPAD? Thermally Enhanced Package, Texas Instruments Literature No.
SLMA002 and Application Brief, PowerPAD? Made Easy, Texas Instruments Literature No. SLMA004 .
The exposed thermal pad dimensions for the PWP 14 pin and QFN 16 pin packages are shown in the Thermal
Pad Mechanical Data section of this data sheet.
14
Product Folder Link(s) : TPS54326
Copyright ? 2009–2012, Texas Instruments Incorporated
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