参数资料
型号: TPS54326RGTT
厂商: Texas Instruments
文件页数: 2/29页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 3A 16QFN
标准包装: 250
系列: SWIFT™, D-CAP2™
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.76 V ~ 5.5 V
输入电压: 2 V ~ 18 V
PWM 型: 混合物
频率 - 开关: 700kHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-VFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-QFN-EP(3x3)

SLVSA13E – OCTOBER 2009 – REVISED JUNE 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
T A
PACKAGE (2)
(3)
ORDERABLE PART NUMBER
PIN
TRANSPORT
MEDIA
–40°C to 85°C
PowerPAD?
(HTSSOP) – PWP
Plastic Quad Flat Pack (QFN)
TPS54326PWP
TPS54326PWPR
TPS54326RGTT
TPS54326RGTR
14
16
Tube
Tape and Reel
Tape and Reel
Tape and Reel
(1)
(2)
(3)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
All package options have Cu NIPDAU lead/ball finish.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
V IN , V CC , EN
V BST
–0.3 to 20
–0.3 to 26
V
V
V I
V O
V diff
Input voltage range
Output voltage range
Voltage from GND to POWERPAD
V BST (vs SW1, SW2)
V FB , V O , SS, PG
SW1, SW2
SW1, SW2 (10 ns transient)
V REG5
P GND1 , P GND2
–0.3 to 6.5
–0.3 to 6.5
–2 to 20
–3 to 20
–0.3 to 6.5
–0.3 to 0.3
–0.2 to 0.2
V
V
V
V
V
V
V
ESD rating Electrostatic discharge
Human Body Model (HBM)
Charged Device Model (CDM)
2
500
kV
V
T J
T stg
Operating junction temperature
Storage temperature
–40 to 150
–55 to 150
°C
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS54326
TPS54326
THERMAL METRIC
(1)
PWP
RGT
UNITS
14 PINS
16 PINS
θ JA
θ JCtop
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
55.6
51.3
46.1
58.1
θ JB
ψ JT
ψ JB
θ JCbot
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
26.4
1.8
20.6
4.3
18.8
1.3
18.8
4.8
°C/W
(1)
2
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 .
Copyright ? 2009–2012, Texas Instruments Incorporated
Product Folder Link(s) : TPS54326
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