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| 型号： | TWR-ELEV |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/48页 |
| 文件大小： | 0K |
| 描述： | TOWER ELEVATOR BOARDS HARDWARE |
| 其它有关文件： | TWR-ELEV Dummy Schematic TWR-ELEV Functional Schematic |
| 产品培训模块： | MCF51CN Family - Ultimate Ethernet Solutions Tower System |
| 特色产品： | The Tower System |
| 标准包装： | 1 |
| 系列： | ColdFire® |
| 附件类型： | 2 个升降机板 |
| 适用于相关产品： | Freescale 电源塔系统 |
| 产品目录页面： | 734 (CN2011-ZH PDF) |
| 相关产品： | TWR-SER-ND - TOWER SERIAL I/O HARDWARE TWR-MCF51CN-ND - KIT TOWER BOARD TWR-MCF51CN-KIT-ND - KIT TOWER BOARD/SERIAL/ELEVATOR |
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Electrical Characteristics
MCF51CN128 ColdFire Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
13
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 5. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
(–40 to 85 or 0 to 70)1
1 Depending on device.
°C
Maximum junction temperature
TJM
95
°C
Thermal resistance
Single-layer board
48-pin QFN
θ
JA
81
°C/W
64-pin LQFP
69
80-pin LQFP
60
Thermal resistance
Four-layer board
48-pin QFN
θ
JA
26
°C/W
64-pin LQFP
50
80-pin LQFP
47
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| 2-1589449-6 | STRIP CON |
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| OPAMPEVM-SOIC | UNIV EVAL MOD FOR SOP PKG |
| 2-1589448-0 | STRIP CON |
| HFI-100505-2N2S | INDUCTOR 1.0X0.5X0.5MM 2.2NH |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TWR-ELEV | 制造商:Freescale Semiconductor 功能描述:Tower System - Elevator Boards |
| TWR-FRAM | 功能描述:存储器 IC 开发工具 Freescale Tower FRAM Daughter Card RoHS:否 制造商:STMicroelectronics 产品:Reference Boards 工具用于评估:M24LR64-R 存储容量:64 kbit 存储类型:EEPROM 工作电源电压:1.8 V to 5.5 V |
| TWR-HW | 功能描述:WIRELESS RELAY 120/277 HARD WIRE 制造商:thomas research products 系列:ZenNet 零件状态:过期 配件类型:无线继电器 配套使用产品/相关产品:* 标准包装:1 |
| TWR-IND-IO | 功能描述:界面开发工具 IND CTRL Tower IO RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| TWR-K20D50M | 功能描述:开发板和工具包 - ARM PK20DX128VLH5 EvBrd RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V |
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