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参数资料
| 型号： | UPD750004GBA-XXX-3BS-MTX |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PQFP44 |
| 封装： | 10 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 |
| 文件页数： | 73/86页 |
| 文件大小： | 626K |
| 代理商： | UPD750004GBA-XXX-3BS-MTX |
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PD750004, 750006, 750008, 750004(A), 750006(A), 750008(A)
73
Data Sheet U10738EJ3V2DS
15. RECOMMENDED SOLDERING CONDITIONS
The
PD750004, PD750006, and PD750008 should be soldered and mounted under the following recommended
conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 15-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD750004GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
PD750006GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
PD750008GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
PD750004GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
PD750006GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
PD750008GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
Soldering
Soldering Conditions
Recommended
Method
Condition Symbol
Infrared reflow
Package peak temperature: 235C, Time: 30 seconds max. (at 210C or higher),
IR35-00-3
Count: Three times or less
VPS
Package peak temperature: 215C, Time: 40 seconds max. (at 200C or higher),
VP15-00-3
Count: Twice or less
Wave soldering
Solder bath temperature: 260C max., Time: 10 seconds max., Count: Once
WS60-00-1
Preheating temperature: 120C max. (package surface temperature)
Partial heating
Pin temperature: 350C max., Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
Remark
For soldering methods and conditions other than those recommended above, contact an NEC Electronics
sales representative.
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