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参数资料
| 型号： | UPD750004GBA-XXX-3BS-MTX |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PQFP44 |
| 封装： | 10 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 |
| 文件页数： | 74/86页 |
| 文件大小： | 626K |
| 代理商： | UPD750004GBA-XXX-3BS-MTX |
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PD750004, 750006, 750008, 750004(A), 750006(A), 750008(A)
74
Data Sheet U10738EJ3V2DS
Table 15-1. Surface Mounting Type Soldering Conditions (2/2)
(2)
PD750004GB-×××-3BS-MTX-A: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
PD750006GB-×××-3BS-MTX-A: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
PD750008GB-×××-3BS-MTX-A: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
Soldering
Soldering Conditions
Recommended
Method
Condition Symbol
Infrared reflow
Package peak temperature: 260C, Time: 60 seconds max. (at 220C or higher),
IR60-207-3
Count: Three times or less,
Exposure limit: 7 days
Note (after that, prebake at 125C for 20 to 72 hours)
Wave soldering
For details, contact an NEC Electronics sales representative.
—
Partial heating
Pin temperature: 350C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with “-A” at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
Table 15-2. Insertion Type Soldering Conditions
PD750004CU-×××:
42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750006CU-×××:
42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750008CU-×××:
42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750004CU-×××-A: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750006CU-×××-A: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750008CU-×××-A: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750004CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750006CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
PD750008CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260C max., Time: 10 seconds max.
Partial heating
Pin temperature: 300C max., Time: 3 seconds max. (for each pin)
Caution Apply wave soldering to pins only. See to it that the jet solder does not contact with the chip directly.
Remarks 1. Products with “-A" at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
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