参数资料
型号: W25Q32BVZEIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 8 X 6 MM, GREEN, WSON-8
文件页数: 11/79页
文件大小: 1090K
代理商: W25Q32BVZEIG
W25Q32BV
Publication Release Date: April 01, 2011
- 19 -
Revision F
7.2 INSTRUCTIONS
The instruction set of the W25Q32BV consists of thirty five basic instructions that are fully controlled
through the SPI bus (see Instruction Set table1-3). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the DI
input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 4
through 37. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
7.2.1
Manufacturer and Device Identification
MANUFACTURER ID
(MF7-MF0)
Winbond Serial Flash
EFh
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25Q32BV
15h
4016h
相关PDF资料
PDF描述
W3EG7264S202AD4MG 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA200
WEDF1M32B-70H1I5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CPGA66
WE128K32N-125H1M 128K X 32 EEPROM 5V MODULE, 125 ns, CPGA66
W3E32M72S-266SBI 32M X 72 DDR DRAM, 0.75 ns, PBGA208
W3EG6466S202AD4MG 64M X 64 DDR DRAM MODULE, 0.75 ns, DMA200
相关代理商/技术参数
参数描述
W25Q32BVZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPIG 功能描述:IC SPI FLASH 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W25Q32BVZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI