参数资料
型号: W25Q64BVZEIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 8 X 6 MM, GREEN, WSON-8
文件页数: 13/61页
文件大小: 1726K
代理商: W25Q64BVZEIP
W25Q64BV
- 20 -
11.2.4 Write Enable (06h)
The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to a
1. The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase and
Write Status Register instruction. The Write Enable instruction is entered by driving /CS low, shifting the
instruction code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then driving /CS high.
Figure 4. Write Enable Instruction Sequence Diagram
11.2.5 Write Disable (04h)
The Write Disable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status Register to
a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h” into the
DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon
completion of the Write Status Register, Page Program, Sector Erase, Block Erase and Chip Erase
instructions.
Figure 5. Write Disable Instruction Sequence Diagram
相关PDF资料
PDF描述
W3DG634V7D2 4M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WPF512K8C70TFI5 512K X 8 FLASH 5V PROM, 70 ns, PDSO32
WPF512K8C90TRM5 512K X 8 FLASH 5V PROM, 90 ns, PDSO32
WS512K32F-35H2C 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHMA66
WS512K32F-45G2TC 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CQMA68
相关代理商/技术参数
参数描述
W25Q64CV 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI