参数资料
型号: W25Q64BVZEIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 8 X 6 MM, GREEN, WSON-8
文件页数: 51/61页
文件大小: 1726K
代理商: W25Q64BVZEIP
W25Q64BV
Publication Release Date: July 08, 2010
- 55 -
Revision E
13.
PACKAGE SPECIFICATION
13.1 8-Pin SOIC 208-mil (Package Code SS)
θ
GAUGE PLANE
θ
GAUGE PLANE
MILLIMETERS
INCHES
SYMBOL
Min
Nom
Max
Min
Nom
Max
A
1.75
1.95
2.16
0.069
0.077
0.085
A1
0.05
0.15
0.25
0.002
0.006
0.010
A2
1.70
1.80
1.91
0.067
0.071
0.075
b
0.35
0.42
0.48
0.014
0.017
0.019
C
0.19
0.20
0.25
0.007
0.008
0.010
D
5.18
5.28
5.38
0.204
0.208
0.212
D1
5.13
5.23
5.33
0.202
0.206
0.210
E
5.18
5.28
5.38
0.204
0.208
0.212
E1
5.13
5.23
5.33
0.202
0.206
0.210
e
(2)
1.27 BSC.
0.050 BSC.
H
7.70
7.90
8.10
0.303
0.311
0.319
L
0.50
0.65
0.80
0.020
0.026
0.031
y
---
0.10
---
0.004
θ
---
---
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
相关PDF资料
PDF描述
W3DG634V7D2 4M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WPF512K8C70TFI5 512K X 8 FLASH 5V PROM, 70 ns, PDSO32
WPF512K8C90TRM5 512K X 8 FLASH 5V PROM, 90 ns, PDSO32
WS512K32F-35H2C 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHMA66
WS512K32F-45G2TC 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CQMA68
相关代理商/技术参数
参数描述
W25Q64CV 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI