参数资料
型号: W25Q64CVSSIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.208 INCH, GREEN, SOIC-8
文件页数: 56/79页
文件大小: 1086K
代理商: W25Q64CVSSIG
W25Q64CV
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3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64CV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm
(package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC 208-mil
1
2
3
4
8
7
6
5
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOLD (IO
DI (IO
0)
CLK
Top View
3)
Figure 1a. W25Q64CV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
1
2
3
4
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOLD (IO
3)
DI (IO
0)
CLK
Top View
8
7
6
5
Figure 1b. W25Q64CV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP & ZE)
相关PDF资料
PDF描述
W25Q64CVZPAP 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
WMS128K8C-25CQE 128K X 8 STANDARD SRAM, 25 ns, CDIP32
WMF512K8X-150DEC5 512K X 8 FLASH 5V PROM, 150 ns, CDSO32
WME128K8X-200DEC 128K X 8 EEPROM 5V, 200 ns, CDSO32
WMF512K8X-70FEM5 512K X 8 FLASH 5V PROM, 70 ns, CDFP32
相关代理商/技术参数
参数描述
W25Q64CVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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W25Q64CVTCAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVTCIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVTCIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI