参数资料
型号: W25Q64DWZPIG
厂商: Winbond Electronics
文件页数: 4/82页
文件大小: 0K
描述: IC FLASH SPI 64MBIT 8WSON
标准包装: 100
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(6x5)
包装: 管件
W25Q64DW
10.2.41
10.2.42
Disable QPI (FFh) ............................................................................................................. 66
Enable Reset (66h) and Reset (99h) ................................................................................ 67
11.
ELECTRICAL CHARACTERISTICS ............................................................................................... 68
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
Absolute Maximum Ratings ................................................................................................ 68
Operating Ranges............................................................................................................... 68
Power-Up Power-Down Timing and Requirements ............................................................ 69
DC Electrical Characteristics .............................................................................................. 70
AC Measurement Conditions .............................................................................................. 71
AC Electrical Characteristics .............................................................................................. 72
AC Electrical Characteristics (cont’d) ................................................................................. 73
Serial Output Timing ........................................................................................................... 74
Serial Input Timing .............................................................................................................. 74
HOLD Timing .................................................................................................................... 74
WP Timing ........................................................................................................................ 74
12.
PACKAGE SPECIFICATION .......................................................................................................... 75
12.1
12.2
12.3
12.4
8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 75
8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 76
8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 78
16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 79
13.
ORDERING INFORMATION .......................................................................................................... 80
13.1
Valid Part Numbers and Top Side Marking ........................................................................ 81
14.
REVISION HISTORY ...................................................................................................................... 82
-4-
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