参数资料
| 型号： | W25Q64DWZPIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 57/82页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 64MBIT 8WSON |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.7 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-WSON（6x5） |
| 包装： | 管件 |
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W25Q64DW
10.2.32 Read Manufacturer / Device ID Quad I/O (94h)
The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 4x speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by a
four clock dummy cycles and then a 24-bit address (A23-A0) of 000000h, but with the capability to input
the Address bits four bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID
are shifted out four bits per clock on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 31. The Device ID values for the W25Q64DW is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
CLK
Mode 0
Instruction (94h)
A23-16
A15-8
A7-0
(00h)
M7-0
Dummy
Dummy
IOs switch from
Input to Output
IO 0
4
0
4
0
4
0
4
0
4
0
4
0
IO 1
IO 2
IO 3
High Impedance
High Impedance
High Impedance
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
/CS
MFR ID
Device ID
23
24
25
26
27
28
29
30
Mode 3
CLK
Mode 0
IO 0
IO 1
IO 2
IO 3
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
MFR ID
(repeat)
Device ID
(repeat)
MFR ID
(repeat)
Device ID
(repeat)
Figure 31. Read Manufacturer / Device ID Quad I/O Instruction (SPI Mode only)
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction.
Publication Release Date: September 18, 2012
- 57 -
Revision D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64DWZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVDAIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVDAIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVSFIG | 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M（256K x 18） 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x20） 包装:托盘 |
| W25Q64FVSFIG TR | 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC |
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