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| 型号： | W25Q64FVSFIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/89页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 64MBIT 16SOIC |
| 标准包装： | 44 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
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W25Q64FV
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
Erase/Program Suspend Status (SUS) ................................................................................ 16
Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 16
Quad Enable (QE) .............................................................................................................. 17
W25Q64FV Status Register Memory Protection (CMP = 0) ............................................... 18
W25Q64FV Status Register Memory Protection (CMP = 1) ............................................... 19
6.2
INSTRUCTIONS................................................................................................................. 20
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.2.9
6.2.10
6.2.11
6.2.12
6.2.13
6.2.14
6.2.15
6.2.16
6.2.17
6.2.18
6.2.19
6.2.20
6.2.21
6.2.22
6.2.23
6.2.24
6.2.25
6.2.26
6.2.27
6.2.28
6.2.29
6.2.30
6.2.31
6.2.32
6.2.33
6.2.34
6.2.35
Manufacturer and Device Identification ................................................................................ 20
Instruction Set Table 1 (Standard SPI Instructions) (1) ........................................................... 21
Instruction Set Table 2 (Dual SPI Instructions) ..................................................................... 22
Instruction Set Table 3 (Quad SPI Instructions) ................................................................... 22
Instruction Set Table 4 (QPI Instructions) (14) ........................................................................ 23
Write Enable (06h) ............................................................................................................... 25
Write Enable for Volatile Status Register (50h) .................................................................... 25
Write Disable (04h) ............................................................................................................... 26
Read Status Register-1 (05h) and Read Status Register-2 (35h)......................................... 26
Write Status Register (01h) ................................................................................................ 27
Read Data (03h) ................................................................................................................. 29
Fast Read (0Bh) ................................................................................................................. 30
Fast Read Dual Output (3Bh) ............................................................................................. 32
Fast Read Quad Output (6Bh)............................................................................................ 33
Fast Read Dual I/O (BBh)................................................................................................... 34
Fast Read Quad I/O (EBh) ................................................................................................. 36
Word Read Quad I/O (E7h) ................................................................................................ 39
Octal Word Read Quad I/O (E3h) ....................................................................................... 41
Set Burst with Wrap (77h) .................................................................................................. 43
Page Program (02h) ........................................................................................................... 44
Quad Input Page Program (32h) ........................................................................................ 46
Sector Erase (20h) ............................................................................................................. 47
32KB Block Erase (52h) ..................................................................................................... 48
64KB Block Erase (D8h)..................................................................................................... 49
Chip Erase (C7h / 60h) ....................................................................................................... 50
Erase / Program Suspend (75h) ......................................................................................... 51
Erase / Program Resume (7Ah) ......................................................................................... 53
Power-down (B9h) .............................................................................................................. 54
Release Power-down / Device ID (ABh) ............................................................................. 55
Read Manufacturer / Device ID (90h) ................................................................................. 57
Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 58
Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 59
Read Unique ID Number (4Bh) .......................................................................................... 60
Read JEDEC ID (9Fh) ........................................................................................................ 61
Read SFDP Register (5Ah) ................................................................................................ 62
Publication Release Date: October 07, 2013
-3-
Revision L
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64FVSFIG TR | 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC |
| W25Q64FVSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVSSIG | 功能描述:IC SPI FLASH 64MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q64FVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64FVSSIG/TRAY | 制造商:Winbond Electronics Corp 功能描述: |
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