参数资料
| 型号： | W25Q80BWZPIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 74/74页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 8MBIT 8WSON |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 8M（1M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.65 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-WSON（6x5） |
| 包装： | 管件 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页当前第74页
W25Q80BW
11. REVISION HISTORY
VERSION
A
B
C
D
E
F
G
H
I
J
DATE
01/26/11
06/21/11
07/15/11
11/16/11
04/23/12
06/21/12
08/24/12
10/15/12
11/19/12
07/30/13
PAGE
All
7, 70-72
58, 60, 62
65-69
64
21-57
5-7, 69-71
6, 66, 68, 72-73
72-73
71-73
All
66
71
45, 46
59
60
DESCRIPTION
New Create Preliminary
Added dBGA (WLCSP) package type
Updated ICC1/2/4, fR for Continuous Read Mode
Updated package dimension drawings
Added /WP timing diagram
Updated all instruction diagrams (non-technical)
Removed USON package
Updated package name to WLBGA
Added VSOP package types
Added L order option
Added WLBGA with backside coating order option
Removed preliminary designator
Updated VSOP package dimensions
Updated WLBGA package dimensions
Removed Suspend/Resume description, added
note
Modified the typo of Vcc range
Added Power-up, Power-Down Requirement
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Furthermore, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur. Winbond customers using or
selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.
- 74 -
相关PDF资料 |
PDF描述 |
|---|---|
| W25Q40BWSNIG | IC FLASH SPI 4MBIT 8SOIC |
| W25Q16CVSSIG | IC SPI FLASH 16MBIT 8SOIC |
| AX1000-FG896I | IC FPGA AXCELERATOR 1M 896-FBGA |
| W25Q16BVZPIG | IC SPI FLASH 16MBIT 8WSON |
| W25Q80BVDAIG | SPI FLASH 8MBIT 8-DIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q80BWZPIG TR | 功能描述:IC FLASH SPI 8MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q80BWZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25S243A | 制造商:WINBOND 制造商全称:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25S243A-12 | 制造商:WINBOND 制造商全称:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25S243AD-12 | 制造商:WINBOND 制造商全称:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
发布紧急采购，3分钟左右您将得到回复。