参数资料
型号: W25X40BVSNIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 4M X 1 FLASH 2.7V PROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 28/51页
文件大小: 1632K
代理商: W25X40BVSNIG
W25X10BV/20BV/40BV
- 34 -
9.2.21
Read Manufacturer / Device ID Dual I/O (92h)
The Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer/Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 2x
speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “92h”
followed by a 24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two
bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2
bits per clock on the falling edge of CLK with most significant bits (MSB) first as shown in figure 22.
The Device ID values for the W25X10BV/20BV/40BV are listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and
then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously,
alternating from one to the other. The instruction is completed by driving /CS high.
Figure 22. Read Manufacturer / Device ID Dual I/O Diagram
Note:
The “Continuous Read Mode” bits M7-0 must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
相关PDF资料
PDF描述
W3EG72126S202AJD3MF 128M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
W3EG72126S335AJD3MG 128M X 72 DDR DRAM MODULE, 0.7 ns, DMA184
W3H128M72ER2-667SBM 128M X 72 DDR DRAM, 0.5 ns, PBGA255
W7NCF01GH10CS6BG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF01GH10IS7AG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
相关代理商/技术参数
参数描述
W25X40BVSSIG 功能描述:IC SPI FLASH 4MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W25X40BVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 4M-BIT, 4KB UNIFORM 制造商:Winbond 功能描述:SPIFLASH, 4M-BIT, 4KB UNIFORM
W25X40BVZPIG 功能描述:IC SPI FLASH 4MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8
W25X40CLDAIG 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 104MHZ 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 104MHZ 8DIP
W25X40CLSNIG 功能描述:IC FLASH SPI 4MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8