参数资料
型号: W3H64M72E-533ESI
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 64M X 72 DDR DRAM, 0.5 ns, PBGA208
封装: 17 X 23 MM, 1 MM PITCH, PLASTIC, BGA-208
文件页数: 13/30页
文件大小: 999K
代理商: W3H64M72E-533ESI
W3H64M72E-XSBX
20
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
December 2006
Rev. 2
ADVANCED*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 12 – WRITE COMMAND
CS#
WE#
CAS#
RAS#
CKE
CA
A10
BANK ADDRESS
HIGH
EN AP
DIS AP
BA
CK
CK#
DON’T CARE
ADDRESS
Note: CA = column address; BA = bank address; EN AP = enable auto precharge; and
DIS AP = disable auto precharge.
TABLE 4 – WRITE USING CONCURRENT AUTO PRECHARGE
From Command (Bank n)
To Command (Bank m)
Minimum Delay (With Concurrent
Auto Precharge)
Units
WRITE with Auto Precharge
READ OR READ w/AP
(CL-1) + (BL/2) + tWTR
t
CK
WRITE or WRITE w/AP
(BL/2)
t
CK
PRECHARGE or ACTIVE
1
t
CK
相关PDF资料
PDF描述
WS128K32V-35HC 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, HIP66
WS128K32V-55HQ 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, HIP66
WS128K32V-55HS 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, HIP66
WMF256K8-70FEC5 256K X 8 FLASH 5V PROM, 70 ns, CDFP32
WPF2M32V-90PSC5T 2M X 32 FLASH 5V PROM MODULE, 90 ns, PSMA80
相关代理商/技术参数
参数描述
W3H64M72E-533ESM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SB 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBC 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA COMMERICAL TEMP. - Bulk
W3H64M72E-533SBI 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H64M72E-533SBM 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk