参数资料
型号: W3H64M72E-533ESI
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 64M X 72 DDR DRAM, 0.5 ns, PBGA208
封装: 17 X 23 MM, 1 MM PITCH, PLASTIC, BGA-208
文件页数: 21/30页
文件大小: 999K
代理商: W3H64M72E-533ESI
W3H64M72E-XSBX
28
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
December 2006
Rev. 2
ADVANCED*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
All linear dimensions are millimeters and parenthetically in inches
BOTTOM VIEW
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
11 10
9
8
7
6
5
4
3
2
1
208 x 0.51 (0.020) NOM
1.0 (0.039)NOM
10.0 (0.394) NOM
17.15 (0.675) MAX
23.15
(0.91
1)
MAX
18.0
(0.709)
NOM
1.0
(0.039)
NOM
3.20 (0.126) MAX
0.44
(0.017)
NOM
相关PDF资料
PDF描述
WS128K32V-35HC 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, HIP66
WS128K32V-55HQ 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, HIP66
WS128K32V-55HS 512K X 8 MULTI DEVICE SRAM MODULE, 55 ns, HIP66
WMF256K8-70FEC5 256K X 8 FLASH 5V PROM, 70 ns, CDFP32
WPF2M32V-90PSC5T 2M X 32 FLASH 5V PROM MODULE, 90 ns, PSMA80
相关代理商/技术参数
参数描述
W3H64M72E-533ESM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SB 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-533SBC 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA COMMERICAL TEMP. - Bulk
W3H64M72E-533SBI 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H64M72E-533SBM 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk