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参数资料
| 型号： | W764M32VESSB |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 14/16页 |
| 文件大小： | 496K |
| 代理商： | W764M32VESSB |
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
January 2007
Rev. 3
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 2: AC WAVEFORMS FOR READ OPERATIONS
Addresses
CS#
OE#
WE#
Outputs
High Z
Addresses Stable
tOE
tRC
Output Valid
tCE
tACC
tOH
High Z
tDF
RESET#
RY/BY#
OV
tOEH
FIGURE 3: PAGE READ TIMING
Amax-A2
CE#
OE#
A2 -A-1
Data Bus
Same Page
Aa
Ab
Ac
Ad
Qa
Qb
Qc
Qd
tACC
tPACC
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相关代理商/技术参数 |
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|---|---|
| W764M32VESSBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32VESSBI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32VESSBM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V-XSBX | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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