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参数资料
| 型号： | W764M32VESSB |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 16/16页 |
| 文件大小： | 496K |
| 代理商： | W764M32VESSB |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
January 2007
Rev. 3
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 6: PROGRAM OPERATIONS
Addresses
CS#
OE#
WE#
Data
RY/BY#
VCC
555h
PA
tWC
tAH
tWHWH1
PD
Status
DOUT
A0h
tBUSY
PA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
NOTES:
1.
PA is the address of the memory location to be programmed.
2.
PD is the data to be programmed at byte address.
3.
DOUT is the output of the data written to the device.
4.
Figure indicates last two bus cycles of four bus cycle sequence.
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| W764M32VESSBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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