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参数资料
| 型号： | W764M32VESSB |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 8/16页 |
| 文件大小： | 496K |
| 代理商： | W764M32VESSB |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
January 2007
Rev. 3
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
64Mx32 Flash 3.3V
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
November 2005
Advanced
Rev 1
Changes (All Pages)
1.1 Add AC + DC characteristics and timing diagrams
1.2 Update package dimensions
1.3 Add preliminary pinout
February 2006
Advanced
Rev 2
Changes (Pg. 1, 3, 16)
2.1 Correct typographical error in pinout on page 3, ball 'B4' is
DQ9
March 2006
Advanced
Rev 3
Changes (Pg. 1, 2, 16)
3.1 Change status to Preliminary
3.2 Remove reference to BYTE# input and 64-bit data bus.
These options are not available
3.3 Add capacitance values to table
January 2007
Preliminary
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W764M32VESSBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32VESSBI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32VESSBM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V-XSBX | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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