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参数资料
| 型号： | W764M32VESSB |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 2/16页 |
| 文件大小： | 496K |
| 代理商： | W764M32VESSB |
10
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
January 2007
Rev. 3
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 7: ACCELERATED PROGRAM TIMING DIAGRAM
FIGURE 8: CHIP/SECTOR ERASE OPERATION TIMINGS
VHH
tVHH
VIL or VIH
WP#/ACC
VIL or VIH
tDH
2AAh
SA
VA
tWC
tAH
tWHWH2
30h
In
Progress
Complete
55h
tBUSY
VA
tAS
tCH
tWP
tCS
tWPH
tDS
tVCS
tRB
10 for Chip Erase
555h for
chip erase
Addresses
CS#
OE#
WE#
Data
RY/BY#
VCC
NOTES: 1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data
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相关代理商/技术参数 |
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| W764M32VESSBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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