参数资料
| 型号： | W948D6FBHX5E |
| 厂商： | Winbond Electronics |
| 文件页数： | 21/60页 |
| 文件大小： | 0K |
| 描述： | IC LPDDR SDRAM 256MBIT 60VFBGA |
| 标准包装： | 312 |
| 格式 - 存储器： | RAM |
| 存储器类型： | 移动 LPDDR SDRAM |
| 存储容量： | 256M（16Mx16） |
| 速度： | 200MHz |
| 接口： | 并联 |
| 电源电压： | 1.7 V ~ 1.95 V |
| 工作温度： | -25°C ~ 85°C |
| 封装/外壳： | 60-TFBGA |
| 供应商设备封装： | 60-VFBGA（8x9） |
| 包装： | 托盘 |
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W948D6FB / W948D2FB
256Mb Mobile LPDDR
6.11.3 Truth Table - DM Operations
FUNCTION
Write Enable
Write Inhibit
DM
L
H
DQ
Valid
X
NOTES
1
1
Notes:
1.
Used to mask write data, provided coincident with the corresponding data.
6.11.4 Truth Table - CKE
CKEn-1
L
L
L
L
L
L
H
H
H
H
CKEn
L
L
L
H
H
H
L
L
L
L
CURRENT STATE
Power Down
Self Refresh
Deep Power Down
Power Down
Self Refresh
Deep Power Down
All Banks Idle
Bank(s) Active
All Banks Idle
All Banks Idle
COMMANDn
X
X
X
NOP or DESELECT
NOP or DESELECT
NOP or DESELECT
NOP or DESELECT
NOP or DESELECT
AUTO REFRESH
BURST TERMINATE
ACTIONn
Maintain Power Down
Maintain Self Refresh
Maintain Deep Power Down
Exit Power Down
Exit Self Refresh
Exit Deep Power Down
Precharge Power Down Entry
Active Power Down Entry
Self Refresh Entry
Enter Deep Power Down
NOTES
5, 6, 9
5, 7, 10
5, 8
5
5
Notes:
H
H
See the other Truth Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous clock edge.
Current state is the state of LPDDR SDRAM immediately prior to clock edge n.
COMMANDn is the command registered at clock edge n, and ACTIONn is the result of COMMANDn.
All states and sequences not shown are illegal or reserved.
DESELECT and NOP are functionally interchangeable.
Power Down exit time (tXP) should elapse before a command other than NOP or DESELECT is issued.
SELF REFRESH exit time (tXSR) should elapse before a command other than NOP or DESELECT is issued.
The Deep Power-Down exit procedure must be followed as discussed in the Deep Power-Down section of the Functional
Description.
The clock must toggle at least once during the tXP period.
The clock must toggle at least once during the tXSR time.
Publication Release Date : Oct, 15, 2012
- 21 -
Revision : A01-004
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W948D6FBHX5ETR | 制造商:Winbond Electronics Corp 功能描述:256M MDDR, X16, 200MHZ |
| W948D6FBHX5I | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 1.8V 60-Pin VFBGA 制造商:Winbond Electronics 功能描述:IC MEMORY |
| W948D6FBHX5I TR | 制造商:Winbond Electronics Corp 功能描述:256M MDDR, X16, 200MHZ, INDUST |
| W948D6FBHX6E | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 1.8V 60-Pin VFBGA 制造商:Winbond Electronics 功能描述:IC MEMORY |
| W948D6FBHX6ETR | 制造商:Winbond Electronics Corp 功能描述:256M MDDR, X16, 166MHZ, 65NM |
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