参数资料
型号: W9816G6IH-6
厂商: Winbond Electronics
文件页数: 5/42页
文件大小: 0K
描述: IC SDRAM 16MBIT 50TSOPII
标准包装: 117
格式 - 存储器: RAM
存储器类型: SDRAM
存储容量: 16M (1M x 16)
速度: 166MHz
接口: 并联
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 50-TSOP(0.400",10.16mm 宽)
供应商设备封装: 50-TSOP II
包装: 托盘
W9816G6IH
5. PIN DESCRIPTION
PIN NUMBER
20 ? 24,
27 ? 32
PIN NAME
A0 ? A10
FUNCTION
Address
DESCRIPTION
Multiplexed pins for row and column address.
Row address: A0 ? A10. Column address: A0 ? A7.
Select bank to activate during row address latch time,
19
BA
Bank Select
or bank to read/write during column address latch
time.
2, 3, 5, 6, 8, 9,
11, 12, 39, 40,
42, 43, 45, 46,
48, 49
DQ0 ? DQ15
Data
Input/ Output
Multiplexed pins for data input and output.
Disable or enable the command decoder. When
18
17
CS
RAS
Chip Select
Row Address
Strobe
command decoder is disabled, new command is
ignored and previous operation continues.
Command input. When sampled at the rising edge of
the clock, RAS , CAS and WE define the operation
to be executed.
16
CAS
Column
Address Strobe Referred to RAS
15
36, 14
35
WE
UDQM/
LDQM
CLK
Write Enable
Input/Output
Mask
Clock Inputs
Referred to RAS
The output buffer is placed at Hi-Z (with latency of 2)
when DQM is sampled high in read cycle. In write
cycle, sampling DQM high will block the write
operation with zero latency.
System clock used to sample inputs on the rising
edge of clock.
CKE controls the clock activation and deactivation.
34
CKE
Clock Enable
When CKE is low, Power Down mode, Suspend
mode, or Self Refresh mode is entered.
1, 25
26, 50
7, 13, 38, 44,
V CC
V SS
V CCQ
Power
Ground
Power for I/O
buffer
Power for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside
DRAM.
Separated power from V CC , used for output buffers to
improve noise immunity.
4, 10, 41, 47
33, 37
V SSQ
NC
Ground for I/O Separated ground from V SS , used for output buffers
buffer to improve noise immunity.
No Connection No connection.
Publication Release Date: Mar. 22, 2010
-5-
Revision A02
相关PDF资料
PDF描述
AX1000-1FG896 IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-FGG896I IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-1FGG896 IC FPGA AXCELERATOR 1M 896-FBGA
W25Q16CVZPIG IC SPI FLASH 16MBIT 8WSON
W25Q80BWZPIG IC FLASH SPI 8MBIT 8WSON
相关代理商/技术参数
参数描述
W9816G6IH-6I 功能描述:IC SDRAM 16MBIT 50TSOPII RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W9816G6IH-7 制造商:WINBOND 制造商全称:Winbond 功能描述:512K 】 2 BANKS 】 16 BITS SDRAM
W9816G6IH-7I 制造商:WINBOND 制造商全称:Winbond 功能描述:512K 】 2 BANKS 】 16 BITS SDRAM
W982504AH-7 制造商:未知厂家 制造商全称:未知厂家 功能描述:x4 SDRAM
W982504AH-75 制造商:未知厂家 制造商全称:未知厂家 功能描述:x4 SDRAM