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参数资料
| 型号： | W986432DH-6 |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | DRAM |
| 英文描述： | 2M X 32 SYNCHRONOUS DRAM, 5 ns, PDSO86 |
| 封装： | 0.400 INCH, 0.50 MM PITCH, TSOP2-86 |
| 文件页数： | 2/48页 |
| 文件大小： | 1648K |
| 代理商： | W986432DH-6 |
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W986432DH
- 10 -
Auto-precharge Command
If A10 is set to high when the Read or Write Command is issued, then the auto-precharge function is
entered. During auto-precharge, a Read Command will execute as normal with the exception that the
active bank will begin to precharge automatically before all burst read cycles have been completed.
Regardless of burst length, it will begin a certain number of clocks prior to the end of the scheduled
burst cycle. The number of clocks is determined by CAS latency.
A Read or Write Command with auto-precharge cannot be interrupted before the entire burst operation
is completed for the same bank. Therefore, use of a Read, Write, or Precharge Command is prohibited
during a read or write cycle with auto-precharge. Once the precharge operation has started, the bank
cannot be reactivated until the Precharge time (tRP) has been satisfied. Issue of Auto-Precharge
command is illegal if the burst is set to full page length. If A10 is high when a Write Command is
issued, the Write with Auto-Precharge function is initiated. The SDRAM automatically enters the
precharge operation one clock delay from the last burst write cycle. This delay is referred to as write
tDPL. The bank undergoing auto-precharge cannot be reactivated until tDPL and tRP are satisfied. This is
referred to as tDAL, Data-in to Active delay (tDAL = tWR + tRP). When using the Auto-precharge Command,
the interval between the Bank Activate Command and the beginning of the internal precharge
operation must satisfy tRAS (min).
Precharge Command
The Precharge Command is used to precharge or close a bank that has been activated. The
Precharge Command is entered when
CS ,
RAS
and
WE
are low and
CAS
is high at the
rising edge of the clock. The Precharge Command can be used to precharge each bank separately or
all banks simultaneously. Three address bits, A10, BS0, and BS1 are used to define which bank(s) is
to be precharged when the command is issued. After the Precharge Command is issued, the
precharged bank must be reactivated before a new read or write access can be executed. The delay
between the Precharge Command and the Activate Command must be greater than or equal to the
Precharge time (tRP).
Self Refresh Command
The Self Refresh Command is defined by having
CS ,
RAS ,
CAS
and CKE held low with
WE
high at the rising edge of the clock. All banks must be idle prior to issuing the Self Refresh Command.
Once the command is registered, CKE must be held low to keep the device in Self Refresh mode.
When the SDRAM has entered Self Refresh mode all of the external control signals, except CKE, are
disabled. The clock is internally disabled during Self Refresh Operation to save power. The device will
exit Self Refresh operation after CKE is returned high. A minimum delay time is required when the
device exits Self Refresh Operation and before the next command can be issued. This delay is equal
to the tAC cycle time plus the Self Refresh exit time.
If, during normal operation, AUTO REFRESH cycles are issued in bursts (as opposed to being evenly
distributed), a burst of 4,096 AUTO REFRESH cycles should be completed just prior to entering and
just after exiting the self refresh mode.
Power Down Mode
The Power Down mode is initiated by holding CKE low. All of the receiver circuits except CKE are
gated off to reduce the power. The Power Down mode does not perform any refresh operations,
therefore the device can not remain in Power Down mode longer than the Refresh period (tREF) of the
device.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W986432DH-6I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SDRAM|4X512KX32|CMOS|TSSOP|86PIN|PLASTIC |
| W986432DH-7 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SDRAM|4X512KX32|CMOS|TSSOP|86PIN|PLASTIC |
| W986432DH-7L | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SDRAM|4X512KX32|CMOS|TSSOP|86PIN|PLASTIC |
| W9864G2DH6 | 制造商:WINBOND 功能描述:New |
| W9864G2GH | 制造商:WINBOND 制造商全称:Winbond 功能描述:512K X 4 BANKS X 32BITS SDRAM |
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