W986432DH
Publication Release Date: July 30, 2002
- 5 -
Revision A5
5. PIN DESCRIPTION
PIN NUMBER
PIN NAME
FUNCTION
DESCRIPTION
24, 25, 26, 27, 60,
61, 62, 63, 64, 65, 66
A0
A10
Address
Multiplexed pins for row and column address.
Row address: A0
A10. Column address:
A0
A7. A10 is sampled during a precharge
command to determine if all banks are to be
precharged or bank selected by BS0, BS1.
22, 23
BS0, BS1
Bank Select
Select bank to activate during row address
latch time, or bank to read/write during
address latch time.
2, 4, 5, 7, 8, 10, 11, 13, 31,
33, 34, 36, 37, 39, 40, 42, 45,
47, 48, 50, 51, 53, 54, 56, 74,
76, 77, 79, 80, 82, 83, 85
DQ0
DQ31
Data Input/
Output
Multiplexed pins for data output and input.
20
CS
Chip Select
Disable or enable the command decoder.
When command decoder is disabled, new
command is ignored and previous operation
continues.
19
RAS
Row Address
Strobe
Command input. When sampled at the rising
edge of the clock
RAS ,
CAS
and
WE
define the operation to be executed.
18
CAS
Column
Address Strobe Referred to
RAS
17
WE
Write Enable
Referred to
RAS
16, 28, 59, 71
DQM0
DQM3
Input/Output
Mask
The output buffer is placed at Hi-Z (with
latency of 2) when DQM is sampled high in
read cycle. In write cycle, sampling DQM high
will block the write operation with zero latency.
68
CLK
Clock Inputs
System clock used to sample inputs on the
rising edge of clock.
67
CKE
Clock Enable
CKE controls the clock activation and
deactivation. When CKE is low, Power Down
mode, Suspend mode, or Self Refresh mode
is entered.
1, 15, 29, 43
VCC
Power (+3.3V)
Power for input buffers and logic circuit inside
DRAM.
44, 58, 72, 86
VSS
Ground
Ground for input buffers and logic circuit
inside DRAM.
3, 9, 35, 41, 49, 55, 75, 81
VCCQ
Power (+3.3V)
for I/O Buffer
Separated power from VCC, to improve DQ
noise immunity.
6, 12, 32, 38, 46, 52, 78, 84
VSSQ
Ground for I/O
Buffer
Separated ground from VSS, to improve DQ
noise immunity.
14, 21, 30, 57, 69, 70, 73
NC
No Connection
No connection