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参数资料
| 型号： | WF1M32B-100H1I3 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 1/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-100H1I3 |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
1Mx32 3.3V Flash Module
FEATURES
Access Times of 100, 120, 150ns
■
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
68 lead, Low Prole CQFP (G2U), 3.5mm
(0.140") square (Package 510)
■
1,000,000 Erase/Program Cycles
■
Sector Architecture
One 16KByte, two 8KBytes, one 32KByte, and
fteen 64kBytes in byte mode
Any combination of sectors can be concurrently
erased. Also supports full chip erase
■
Organized as 1Mx32
■
Commercial, Industrial and Military Temperature
Ranges
■
3.3 Volt for Read and Write Operations
■
Boot Code Sector Architecture (Bottom)
■
Low Power CMOS, 1.0mA Standby
■
Embedded Erase and Program Algorithms
■
Built-in Decoupling Caps for Low Noise Operation
■
Erase Suspend/Resume
Supports reading data from or programing data to
a sector not being erased
■
Low Current Consumption
Typical values at 5MHz:
40mA Active Read Current
80mA Program/Erase Current
■
Weight
WF1M32B-XG2UX3 -8 grams typical
WF1M32B-XH1X3 -13 grams typical
Note: For programming information refer to Flash Programming 8M3 Application Note.
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
RESET#
CS2#
GND
I/O11
A10
A9
A15
VCC
CS1#
A19
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
A17
WE#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4#
NC
I/O27
A4
A5
A6
NC
CS3#
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
PIN CONFIGURATION FOR WF1M32B-XH1X3
Top View
Pin Description
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE#
Write Enable
CS1-4#
Chip Selects
OE#
Output Enable
RESET#
Reset
VCC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram
1M x 8
8
I/O0-7
CS1#
1M x 8
8
I/O8-15
CS2#
1M x 8
8
I/O16-23
CS3#
1M x 8
8
I/O24-31
CS4#
A0-19
OE#
WE#
RESET#
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-100HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-100HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-100HC5 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HC5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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