参数资料
型号: WF1M32B-100H1I3
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66
封装: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 6/13页
文件大小: 600K
代理商: WF1M32B-100H1I3
2
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Pin Conguration for WF1M32B-XG2UX3
Top View
Pin Description
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
RESET
Reset/Powerdown
VCC
Power Supply
GND
Ground
The White 68 lead G2U CQFP lls the
same t and function as the JEDEC 68 lead
CQFJ or 68 PLCC. But the G2U has the
TCE and lead inspection advantage of the
CQFP form.
1M x 8
8
I/O0-7
1M x 8
8
I/O8-15
1M x 8
8
I/O16-23
1M x 8
8
I/O24-31
A0-19
OE#
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
RESET#
Block Diagram
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
V
CC
A1
1
A12
A13
A14
A15
A16
CS1#
OE#
CS2#
A17
WE2#
WE3#
WE4#
A18
A19
NC
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
RESET#
A0
A1
A2
A3
A4
A5
CS3#
GND
CS4#
WE1#
A6
A7
A8
A9
A10
V
CC
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
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相关代理商/技术参数
参数描述
WF1M32B-100HC3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-100HC3A 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-100HC5 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module
WF1M32B-100HC5A 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module
WF1M32B-100HI3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk