- 您现在的位置：买卖IC网 > PDF目录140410 > WF1M32B-100H1I3 (MICROSEMI CORP-PMG MICROELECTRONICS) 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66 PDF资料下载
参数资料
| 型号： | WF1M32B-100H1I3 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 3/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-100H1I3 |
11
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
oo
0.940" TYP
The White 68 lead G2U CQFP lls the same t
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
相关PDF资料 |
PDF描述 |
|---|---|
| WME128K8-120DEM | 128K X 8 EEPROM 5V, 120 ns, CDSO32 |
| WME128K8-250DECE | 128K X 8 EEPROM 5V, 250 ns, CDSO32 |
| WS512K8-120CCE | 512K X 8 MULTI DEVICE SRAM MODULE, 120 ns, CDMA32 |
| WV3DG72256V10AD2I-MG | 256M X 72 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA168 |
| WS512K32V-15G1UC | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-100HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-100HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-100HC5 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HC5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
发布紧急采购，3分钟左右您将得到回复。