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参数资料
| 型号： | WF1M32B-100H1I3 |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 12/13页 |
| 文件大小： | 600K |
| 代理商： | WF1M32B-100H1I3 |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
Addresses
CS#
OE#
WE#
Data
V
CC
5555H
2AAAH
SA
5555H
tWP
tCS
tVCS
1010H/3030H
5555H
8080H
5555H
AAAAH
tAH
tAS
tGHWL
tWPH
tDH
tDS
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-100HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-100HC3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-100HC5 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HC5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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