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参数资料
| 型号： | WF1M32B-150HC3A |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| 封装： | PGA TYPE, CERAMIC, HIP-66 |
| 文件页数： | 11/13页 |
| 文件大小： | 159K |
| 代理商： | WF1M32B-150HC3A |
7
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM
OPERATION, WE CONTROLLED
Addresses
CS
OE
WE
Data
AAAH
PA
tWC
tCS
PD
D
7
D
OUT
tAH
tWPH
tDH
tDS
Data
Polling
tAS
tRC
tWP
A0H
tOE
tDF
tOH
tGHWL
tWHWH1
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PDF描述 |
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| WF1M32B-150HI3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HM3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-120G2TC3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HM3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32BP-100G2TI5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
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