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参数资料
| 型号： | WF1M32B-150HC3A |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| 封装： | PGA TYPE, CERAMIC, HIP-66 |
| 文件页数： | 3/13页 |
| 文件大小： | 159K |
| 代理商： | WF1M32B-150HC3A |
11
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
PACKAGE 509: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
± 0.05 (0.002)
0.27 (0.011)
± 0.04 (0.002)
25.15 (0.990)
± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880)
± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
相关PDF资料 |
PDF描述 |
|---|---|
| WF1M32B-150HI3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HM3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-120G2TC3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
| WF1M32C-100H2M | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CPGA66 |
| WF1M32E-150G2M | 4M X 8 FLASH 12V PROM MODULE, 150 ns, QMA68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HM3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32BP-100G2TI5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
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