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参数资料
| 型号： | WF1M32B-150HC3A |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| 封装： | PGA TYPE, CERAMIC, HIP-66 |
| 文件页数： | 5/13页 |
| 文件大小： | 159K |
| 代理商： | WF1M32B-150HC3A |
13
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
PROGRAMMING VOLTAGE
3 = 3.3V
DEVICE GRADE:
M = Military Screened
-55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H = Ceramic Hex In line Package, HIP (Package 401)
G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
W F 1M32 B - XXX X X 3 X
相关PDF资料 |
PDF描述 |
|---|---|
| WF1M32B-150HI3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HM3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-120G2TC3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
| WF1M32C-100H2M | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CPGA66 |
| WF1M32E-150G2M | 4M X 8 FLASH 12V PROM MODULE, 150 ns, QMA68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HM3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32BP-100G2TI5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
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