参数资料
型号: XA3S1200E-4FTG256I
厂商: Xilinx Inc
文件页数: 22/37页
文件大小: 0K
描述: IC FPGA SPARTAN3E 1200K 256FTBGA
标准包装: 90
系列: Spartan®-3E XA
LAB/CLB数: 8672
逻辑元件/单元数: 19512
RAM 位总计: 516096
输入/输出数: 190
门数: 1200000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DS635 (v2.0) September 9, 2009
Product Specification
29
R
Configuration and JTAG Timing
Table 33: Power-On Timing and the Beginning of Configuration
Symbol
Description
Device
-4 Speed Grade
Units
Min
Max
TPOR(2)
The time from the application of VCCINT, VCCAUX, and VCCO
Bank 2 supply voltage ramps (whichever occurs last) to the
rising transition of the INIT_B pin
XA3S100E
-
5
ms
XA3S250E
-
5
ms
XA3S500E
-
5
ms
XA3S1200E
-
5
ms
XA3S1600E
-
7
ms
TPROG
The width of the low-going pulse on the PROG_B pin
All
0.5
-
μs
TPL(2)
The time from the rising edge of the PROG_B pin to the
rising transition on the INIT_B pin
XA3S100E
-0.5
ms
XA3S250E
-0.5
ms
XA3S500E
-1
ms
XA3S1200E
-2
ms
XA3S1600E
-2
ms
TINIT
Minimum Low pulse width on INIT_B output
All
250
-ns
TICCK(3)
The time from the rising edge of the INIT_B pin to the
generation of the configuration clock signal at the CCLK
output pin
All
0.5
4.0
μs
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 6. This means power must be applied to all VCCINT, VCCO,
and VCCAUX lines.
2.
Power-on reset and the clearing of configuration memory occurs during this period.
3.
This specification applies only to the Master Serial, SPI, BPI-Up, and BPI-Down modes.
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