参数资料
型号: XA3S250E-4TQG144I
厂商: XILINX INC
元件分类: FPGA
英文描述: FPGA, 612 CLBS, 250000 GATES, 572 MHz, PQFP144
封装: LEAD FREE, TQFP-144
文件页数: 28/37页
文件大小: 717K
代理商: XA3S250E-4TQG144I
DS635 (v2.0) September 9, 2009
Product Specification
34
R
Byte Peripheral Interface Configuration Timing
Table 42: Timing for BPI Configuration Mode
Symbol
Description
Minimum
Maximum
Units
TCCLK1
Initial CCLK clock period
TCCLKn
CCLK clock period after FPGA loads ConfigRate setting
TMINIT
Setup time on CSI_B, RDWR_B, and M[2:0] mode pins before the rising
edge of INIT_B
50
-ns
TINITM
Hold time on CSI_B, RDWR_B, and M[2:0] mode pins after the rising
edge of INIT_B
0
-ns
TINITADDR Minimum period of initial A[23:0] address cycle;
LDC[2:0] and HDC are asserted and valid
BPI-UP:
(M[2:0]=<0:1:0>)
55
TCCLK1
cycles
BPI-DN:
(M[2:0]=<0:1:1>)
22
TCCO
Address A[23:0] outputs valid after CCLK falling edge
TDCC
Setup time on D[7:0] data inputs before CCLK rising edge
TCCD
Hold time on D[7:0] data inputs after CCLK rising edge
Table 43: Configuration Timing Requirements for Attached Parallel NOR Flash
Symbol
Description
Requirement
Units
TCE
(tELQV)
Parallel NOR Flash PROM chip-select
time
ns
TOE
(tGLQV)
Parallel NOR Flash PROM
output-enable time
ns
TACC
(tAVQV)
Parallel NOR Flash PROM read access
time
ns
TBYTE
(tFLQV,
tFHQV)
For x8/x16 PROMs only: BYTE# to
output valid time(3)
ns
Notes:
1.
These requirements are for successful FPGA configuration in BPI mode, where the FPGA provides the CCLK frequency. The post
configuration timing can be different to support the specific needs of the application loaded into the FPGA and the resulting clock source.
2.
Subtract additional printed circuit board routing delay as required by the application.
3.
The initial BYTE# timing can be extended using an external, appropriately sized pull-down resistor on the FPGA’s LDC2 pin. The resistor
value also depends on whether the FPGA’s HSWAP pin is High or Low.
T
CE
T
INITADDR
T
OE
T
INITADDR
T
ACC
0.5T
CCLKn min
()
T
CCO
T
DCC
PCB
T
BYTE
T
INITADDR
相关PDF资料
PDF描述
XD-14596F4-364W SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDFP36
XD-14596F4-372Q SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDFP36
XD-14596F4-432 SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDFP36
XD-14596F4-462L SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDFP36
XD-14596F4-504W SYNCHRO OR RESOLVER TO DIGITAL CONVERTER, CDFP36
相关代理商/技术参数
参数描述
XA3S250E-4TQG144Q 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S250E-4VQG100I 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S250E-4VQG100Q 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400-4FGG456I 功能描述:IC FPGA SPARTAN-3 400K 456-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S400-4FGG456Q 功能描述:IC FPGA SPARTAN-3 400K 456-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)