参数资料
型号: XC2S100E-6FT256C
厂商: Xilinx Inc
文件页数: 18/108页
文件大小: 0K
描述: IC FPGA 1.8V 600 CLB'S 256-FBGA
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 90
系列: Spartan®-IIE
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 182
门数: 100000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
其它名称: 122-1208
DS077-2 (v3.0) August 9, 2013
17
Product Specification
Spartan-IIE FPGA Family: Functional Description
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Dedicated Routing
Some classes of signal require dedicated routing resources
to maximize performance. In the Spartan-IIE FPGA archi-
tecture, dedicated routing resources are provided for two
classes of signal.
Horizontal routing resources are provided for on-chip
3-state busses. Four partitionable bus lines are
provided per CLB row, permitting multiple busses
within a row, as shown in Figure 10.
Two dedicated nets per CLB propagate carry signals
vertically to the adjacent CLB.
Global Routing
Global Routing resources distribute clocks and other sig-
nals with very high fanout throughout the device. Spar-
tan-IIE devices include two tiers of global routing resources
referred to as primary and secondary global routing
resources.
The primary global routing resources are four
dedicated global nets with dedicated input pins that are
designed to distribute high-fanout clock signals with
minimal skew. Each global clock net can drive all CLB,
IOB, and block RAM clock pins. The primary global
nets may only be driven by global buffers. There are
four global buffers, one for each global net.
The secondary global routing resources consist of 24
backbone lines, 12 across the top of the chip and 12
across the bottom. From these lines, up to 12 unique
signals per column can be distributed via the 12
longlines in the column. These secondary resources
are more flexible than the primary resources since they
are not restricted to routing only to clock pins.
Clock Distribution
The Spartan-IIE family provides high-speed, low-skew clock
distribution through the primary global routing resources
described above. A typical clock distribution net is shown in
Four global buffers are provided, two at the top center of the
device and two at the bottom center. These drive the four
primary global nets that in turn drive any clock pin.
Four dedicated clock pads are provided, one adjacent to
each of the global buffers. The input to the global buffer is
selected either from these pads or from signals in the gen-
eral purpose routing.
Delay-Locked Loop (DLL)
Associated with each global clock input buffer is a fully digi-
tal Delay-Locked Loop (DLL) that can eliminate skew
between the clock input pad and internal clock-input pins
throughout the device. Each DLL can drive two global clock
networks. The DLL monitors the input clock and the distrib-
uted clock, and automatically adjusts a clock delay element
(Figure 12). Additional delay is introduced such that clock
edges reach internal flip-flops exactly one clock period after
they arrive at the input. This closed-loop system effectively
eliminates clock-distribution delay by ensuring that clock
Figure 10: BUFT Connections to Dedicated Horizontal Bus Lines
CLB
3-State
Lines
DS001_07_090600
Figure 11: Global Clock Distribution Network
Global Clock
Spine
Global Clock
Column
GCLKPAD2
GCLKBUF2
GCLKPAD3
GCLKBUF3
GCLKBUF1
GCLKPAD1
GCLKBUF0
GCLKPAD0
Global
Clock Rows
DS001_08_060100
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XC2S100E6FT256I 制造商:Xilinx 功能描述:
XC2S100E-6FT256I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E-6FTG256C 功能描述:IC SPARTAN-IIE FPGA 100K 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S100E-6FTG256I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E-6PQ208C 功能描述:IC FPGA 1.8V 600 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)